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Product 352
PRODUCT DESCRIPTION TOP-BOND Product 352 is a single component, low viscosity to high viscosity, fast curing UV adhesive designed for LCD、LED、breadboard 、electron welding spot safeguarding or fixed or bonding. The product cures in seconds upon exposure to ultraviolet radiation of 365 nm to form an impact resistant bond which exhibits excellent resistance to prolonged humidity or water immersion.
TYPICAL APPLICATIONS Bonding and sealing or potting applications of glass to aluminum or Stainless Steel, such as glass furniture and artware.
PROPERTIES OF UNCURED MATERIAL
Typical Value Chemical Type Modified acrylate Appearance Clear, pale straw Specific Gravity @ 25°C 1.04 Viscosity @ 25°C, mPa.s (cP) 100-20000 Brookfield Refractive Index @ 25°C, Nr 1.479 Toxicity Low Flash Point (TCC), °C >93
TYPICAL CURING PERFORMANCE Cure Conditions Cure can be effected with both low and high intensity ultraviolet light sources. A low UV intensity of 30 mW/cm2 will cure highly transmitting substrates with < .010” gap in 5 seconds or 0.070” to 0.090” gaps in 10 to 20 seconds. A high UV intensity of 100 mW/cm2 will cure highly transmitting substrates with < .010” gap in 2 seconds or 0.100” to 0.200” gaps in 10 to 20 seconds. The table below represents typical fixture times for glass substrates with no induced gap. Full cure is estimated to be 6X the fixture time upon continued exposure to UV radiation.
NOTE: UV irradiances are measured at 365nm with an OAI 306 UV Powermeter.
Fixture Time, Static UV Intensity, mW/cm2 Fixture Time, Seconds 6 5 to 20 30 4 100 1 Depth of Cure, Static UV Intensity Exposure Time cure thru depth mW/cm2 Seconds mils
6 30 65 30 30 160 30 20 90 30 10 70 100 30 225 100 20 185 100 10 110
Depth of Cure, Dynamic UV Intensity, Cure Speed, Cure thru Depth, mW/cm2 Feet/Minute mils 100 5 70 100 10 50 100 15 25 100 20 10 *Fusion Systems H-bulb - Intensity center under light source. TYPICAL PROPERTIES OF CURED MATERIAL Physical Properties Typical Value Tensile Modulus, ASTM D-638, psi 288,000 Tensile @ Yield, ASTM D-638, psi 6,400 Elongation @ Yield, ASTM D-638,% 4 Tensile @ Break, ASTM D-638, psi 3,700 Elongation @ Break, ASTM D-638, % 27 Hardness, ASTM D-2240, Shore D-2i 75
PERFORMANCE OF CURED MATERIAL Cured Properties Typical Value Tensile-Shear, ASTM D-1002, psi Glass to glass 0” gap 600 Glass to glass 0.020” gap 600 Shear Torque, ASTM D-3658, Ft.lbs Aluminum to glass 100 Shear Strength, ASTM D-4501, psi Steel to glass 1,450 Aluminum to glass 790 Stainless Steel to glass 870 G-10 Epoxy to glass 870 PVC to glass 410 ABS to glass 140 Polycarbonate to glass 180 Acrylic to glass 150 135° Peel, Glass, piw 39
TYPICAL ENVIRONMENTAL RESISTANCE Resistance to Temperature Aged at temperature indicated and tested at 22°C (72°F), values in % retention. Typical Value 121°C (250°F) 149°C (300°F) 500 Hr 1,000 Hr 500 Hr 1,000 Hr Tensile-Shear, ASTM D-1002 Glass to glass 0” gap 100 100 100 100 Glass to glass 0.020” gap 95 95 100 100 Shear Torque, ASTM D-3658 Aluminum to glass 100 100 95 55
Resistance to Humidity Aged at continuous exposure of 49°C (120°F) / condensing humidity and tested at 22°C (72°F) for duration indicated, values in % retention. Typical Value 2 Weeks 4 Weeks Tensile-Shear, ASTM D-1002 Glass to glass 0” gap 100 100 Glass to glass 0.020” gap 100 100 Shear Torque, ASTM D-3658 Aluminum to glass 100 100 Shear Strength, ASTM D-4501, psi Aluminum to glass 100 100 Stainless Steel to glass 100 100 G-10 Epoxy to glass 100 100 PVC to glass 70 60 ABS to glass 100 70 Polycarbonate to glass 100 90 Acrylic to glass 95 75
Resistance to Dishwasher Cycling Aged at continuous dishwater cycling and tested at 22°C (72°F) for duration indicated, values in % retention. Typical Value 25 cycles Tensile-Shear, ASTM D-1002 Glass to glass 0” gap 100 Glass to glass 0.020” gap 88 Shear Torque, ASTM D-3658 Aluminum to glass 100 Shear Strength, ASTM D-4501, psi Aluminum to glass 100 Stainless Steel to glass 100 G-10 Epoxy to glass 100 PVC to glass 50 ABS to glass 65 Polycarbonate to glass 60 Acrylic to glass 90
GENERAL INFORMATION This product is not recommended for use in pure oxygen and/or oxygen rich systems and should not be selected as a sealant for chlorine or other strong oxidizing materials. For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS). Directions for use This product is UV sensitive. Exposure to daylight, UV light and artificial lighting should be kept to a minimum during storage and handling. Product should be dispensed from applicators with black feed lines. For best performance bond surfaces should be clean and free from grease.
UV cure rate is dependent on lamp intensity, distance from light source, depth of cure needed or bondline gap and light transmittance of the substrate through which the radiation must pass. Recommended intensity for cure in an adhesive application (between substrates) is 40 mW/cm2 minimum (measured at the bondline) with an exposure time of 5-6 times the fixture time at this same intensity. For tack-free surface cure, as necessary in coating, potting or tacking applications, higher intensity UV is required (100 mW/cm2 minimum).
Cooling should be provided for temperature sensitive substrate such as thermoplastic. Plastic grades should be checked for risk of stress cracking when exposed to liquid adhesive. Excess adhesive can be wiped away with organic solvent. Bonds should be allowed to cool before subjecting to any service loads.
Storage Products shall be ideally stored in a cool, dry location in unopened containers at a temperature between 8° to 28°C (46° to 82°F) unless otherwise labeled. Optimal storage is at the lower half of this temperature range. To prevent contamination of unused product, do not return any material to its original container. For specific shelf-life information, contact your local Technical Service Center.
Data Ranges The data contained herein may be reported as a typical value and/or range. Values are based on actual test data and are verified on a periodic basis.
Note The data contained herein are furnished for information only and are believed to be reliable. We cannot assume responsibility for the results obtained by others over whose methods we have no control. It is the user's responsibility to determine suitability for the user's purpose of any production methods mentioned herein and to adopt such precautions as may be advisable for the protection of property and of persons against any hazards that may be involved in the handling and use thereof. In light of the foregoing.TOP-BOND Corporation specifically disclaims all warranties expressed or implied, including warranties of merchantability or fitness for a particular purpose, arising from sale or use of TOP-BOND Corporation’s products. TOP-BOND Corporation specifically disclaims any liability for consequential or incidental damages of any kind, including lost profits. The discussion herein of various processes or compositions is not to be interpreted as representation that they are free from domination of patents owned by others or as a license under any TOP-BOND Corporation patents that may cover such processes or compositions. We recommend that each prospective user test his proposed application before repetitive use, using this data as a guide. This product may be covered by one or more China or foreign patents or patent applications.
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